 |
Item ID |
Photo |
Short Description |
Product Type / Details |
#
|
Price |
Notes |
Location |
Make |
Model |
|
|
$ |
|
 |
1973
|
Mill Lane Eng
|
Mill Lane Eng |
4123 |
in Deposition Equipment
MILL LANE ENGINEERING REEL COATER :Reel Coater for Ribbon or Wire
The model 412-3 is a two-chamber reel to reel web coater which deposits metal or alloys on wire or ribbon substrates by sputtering from two magnetron targets arranged in a closely spaced book array. Capacity is based upon 4" ID x 12" OD x 3" wide wire/ribbon spools. Wire diameter up to 0.035" (.9mm) may be coated at speeds ranging between 2 and 40 feet per minute depending on the coating thickness desired. Constant wire speed and tension are controlled in conjunction with other parameters which enable unattended operation for extended periods. A second chamber provides plasma pre cleaning prior to entering the sputter zone through a conductance limiting tube which allows different gas compositions and pressures for cleaning and coating.
|
1
|
|
|
F* |
Scotia, New York |
|
 |
4071
|
MRC
|
MRC |
902 |
in Deposition Equipment
MRC IN-LINE SPUTTER ETCH SYSTEM:In-Line Sputter-Etch System
|
1
|
|
|
F* |
Scotia, New York |
|
 |
32264
|
Varian
|
Varian |
3190 |
in Deposition Equipment
VARIAN 3190 SPUTTER SYSTEM:Load locked single wafer sputter, cassette to cassette vertically mounted for sideways sputter
Currently configured for 100mm wafers 3 Target mini-quantums RF Etch VIPS (Vacuum Isolated Processing Station) Residual Gas Analyzer
|
1
|
|
|
F* |
Scotia, New York |
|
 |
219773
|
Applied Materials
|
Applied Materials |
AKT 1600 |
in Single Wafer Sputtering Tools
AKT APPLIED MATERIALS SPUTTERING TOOL:Cluster Sputtering Tool
|
1
|
|
|
F* |
Scotia, New York |
|
 |
22276
|
CHA Industries
|
CHA Industries |
SSC 1000 |
in Batch Sputtering Tools
CHA INDUSTRIES SPUTTERING SYSTEM:Sputtering System
|
1
|
|
|
F* |
Scotia, New York |
|
 |
256294
|
Nexx Apollo PVD
|
Nexx Apollo PVD |
in Batch Sputtering Tools
Nexx Apollo PVD:The Nexx Apollo PVD system is a fully automated Physical Vapor Deposition (PVD) tool using a multiple wafer multiple chamber design. The system deposits thin metal films used in interconnect metallization on wafers. It uses a staged vacuum system that allow short pump down time to achieve ultra high vacuum. The multi chamber design allows for precise control over all process parameters.
|
1
|
|
|
 |
Kulim, Kedah |
|