Other Information | System Specifications
- Combination high-vac valve,trap and pump
- Micrometer adjustable,variable orifice throttle valve
- CTI ON Board 10 cryopump with 9600 compressor(water cooled)
- CTI On Board auto regeneration control
- Edwards E2M80 mechanical pump
- Mass-Vac Posi-Trap model 345040 molecular sieve trap
- Soft vent
- Soft roughing
- Vacuum manifolding
- Granville-Phillips model 307 ion gauge control
- 28.5" diameter by 16" tall deposition chamber
- 29" Diameter process/source chamber mounting plates
- Source plate has two blank off plates for unused 8" source positions
- Upper mounting plate for cathode,heater array and lower plate for fixturing
- Upper and lower plate hoists
- Motorized hoists with adjustable limit switches
- Flag shutter
- Advanced Energy 3KW RF sputter power supply
- Heater array/Heater power supply for high pressure operation
- (1) Magnetron Cathode: 8 inch
- Inficon IC 5 rate and thickness deposition controller,configured for time/power control with 3.5" floppy disc drive intergrated for control of the shutter and sputter power supply.
Mass flow gas control (02/Ar)
- MKS model 247 power supply/readout
- Two model 2179 mass flow controlers with positive shutoff valves
- MKS model 250 pressure controler
- MKS model 627 pressure transducer
- Industrial grade Siemens PC, 64MB RAM,10.4" TFT color monitor
- Windows NT 4.0 WONDERWARE software
- Controls multi layer,sequential process intergrating the operation,all the controls and power supplies
- Manual vent switch
- Roughing over-time and chamber over pressure interlocks
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